JPH0560208B2 - - Google Patents
Info
- Publication number
- JPH0560208B2 JPH0560208B2 JP27593084A JP27593084A JPH0560208B2 JP H0560208 B2 JPH0560208 B2 JP H0560208B2 JP 27593084 A JP27593084 A JP 27593084A JP 27593084 A JP27593084 A JP 27593084A JP H0560208 B2 JPH0560208 B2 JP H0560208B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- movable
- movable body
- movable contact
- pressure spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000000418 atomic force spectrum Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- -1 mercury halogen Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27593084A JPS61151934A (ja) | 1984-12-25 | 1984-12-25 | 接点装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27593084A JPS61151934A (ja) | 1984-12-25 | 1984-12-25 | 接点装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61151934A JPS61151934A (ja) | 1986-07-10 |
| JPH0560208B2 true JPH0560208B2 (en]) | 1993-09-01 |
Family
ID=17562407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27593084A Granted JPS61151934A (ja) | 1984-12-25 | 1984-12-25 | 接点装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61151934A (en]) |
-
1984
- 1984-12-25 JP JP27593084A patent/JPS61151934A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61151934A (ja) | 1986-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |